IJSTR

International Journal of Scientific & Technology Research

IJSTR@Facebook IJSTR@Twitter IJSTR@Linkedin
Home About Us Scope Editorial Board Blog/Latest News Contact Us
CALL FOR PAPERS
AUTHORS
DOWNLOADS
CONTACT
QR CODE
IJSTR-QR Code

IJSTR >> Volume 3- Issue 9, September 2014 Edition



International Journal of Scientific & Technology Research  
International Journal of Scientific & Technology Research

Website: http://www.ijstr.org

ISSN 2277-8616



A Model Study For The Electric Pulse Frequency Effects On The Solidification Behavior Of Al-5%Cu Alloy

[Full Text]

 

AUTHOR(S)

Qi Jingang, Li Yang, S.A Tukur, Zhao Zuofu, Wu Di, Dai Shan, Wang Jianzhong

 

KEYWORDS

Index Terms: model, electric pulse treatment (EPT), solidification structure, crystal rain, chill layer, Grain-refinement

 

ABSTRACT

Abstract: Electric pulse treatment (EPT) had recently proven to be an effective grain-refining technology; however, the quantitative understanding of the EPT mechanism is still unclear. This research work was based on electromagnetic field theory combined with the EPT mechanism proposed by Zhai et al. In this study, the two critical values of electro-pulse frequency under a certain pulse voltage were calculated; the crystal rain and the chill layer were formed during this non-equilibrium solidification. Thus, the electro-pulse frequencies and their influencing factors were modeled. The solidification behaviors were analyzed accordingly. The model exhibits that the time domain of EPM-induced grain refinement was found to be between the occurrence of crystal rain and the formation of chill layer. Furthermore, the proposed model was validated by the solidification structure changes of Al-5%Cu alloy.

 

REFERENCES

[1] Qi Jingang, Dai Shan, Zhao Zuofu, et al (2011) Effects of electric pulse treatment during solidification on the solidification structure of Al-5%Cu alloy, Advanced Materials Research, 299-300: 572-575

[2] Bottinger, W. J., Coriell, S. R., Greer, A. L. (2000) Solidification Microstructures: Recent Developments, Future Directions ActaMetallurgica Sinica, 48 (1): 43 – 70

[3] Zhang, Z. Z., Song, G. S., Yang, G. C. (1999) Microstructure Characteristics of High Undercooled Bulk Nanocrystalline Fe-B-Si Eutectic Alloy, Acta Metallurgica Sinica, 35(7): 693 – 697

[4] Cui, J. Z. (2003) Solidification of Al Alloys under Electromagnetic Field Transactions of Nonferrous, Metals Society of China, 13(3): 473 – 483

[5] Misra, A. K. (1985) A Novel Solidification Technique of Metals and Alloys: under the Influence of Applied Potential, Metallurgical Transactions A, 16 A (7): pp. 1354 – 1355

[6] Nakada, M., Shiohara, Y.Flemings, M. C. (1990) Modification of Solidification Structures by Pulse Electric Discharging, ISIJ International, 30 (1): 27 – 33

[7] Barnak, J. P., Sprecher, A. F., Conrad, H. Colony. (1995) Grain Size Reduction in Eutectic Pb-Sn Castings by Electroplating, Scripta Metall. 32 (6): 879 – 884

[8] Takagi, T., Iwai, K., Asai, S. (2003) Solidified Structure of Al Alloys by a Local Imposition of an Electromagnetic Oscillating Force. ISIJ International, 43(6): 842 – 848

[9] Li, J. M., Li, S. L., Li, J. (1994) Modification of Solidification Structure by Pulse Electric Discharging. Scripta Metall Mater. 31 (12):1691 – 1694

[10] ZHANG Fucheng, ZHANG Ming, LV Bo,et al. (2007) Effect of High-Energy-Density Pulse Current on Solidification Microstructure of FeCrNi Alloy. Material Science (MEDŽIAGOTYRA). 13(2)

[11] Conrad H., Karam N. and Mannan S. (1983) Effect of electric current pulses on the recrystallization of copper. Scripta Metallurgica, 17:411-416

[12] Conrad H., Karam N. and Mannan S. (1984) Effect of prior cold work on the influence of electric current pulses on the recrystallization of copper, ScriptaMetallurgica, 18: 275-280.

[13] Conrad H., Karam N., Mannan S., et al. (1988) Effect of electric current pulses on the recrystallization kinetics of copper, ScriptaMetallurgica, 22: 235-238

[14] Conrad H., Guo Z., Sprecher A. F. (1990) Effect of electropulse duration and frequency on grain growth in Cu, ScriptaMetallurgicaetMaterialia, 24:359-362

[15] Liao X L, Zhai Q J, Chen W J, et al. (2007) Acta Materialia, 55: 3103

[16] Oono Atsumi. Metal solidification, translated by Teng Y B, Zhang Z Z. Beijing: Mechanical Industry Press, 1983

[17] Fan Y, Liao x, Gan c h, Gong Y Y, et al. (2006) Special Casting & Nonferrous Alloys, 26(3): 192

[18] Misra A.K (1996) Metall Trans, 17A: 358