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IJSTR >> Volume 9 - Issue 1, January 2020 Edition

International Journal of Scientific & Technology Research  
International Journal of Scientific & Technology Research

Website: http://www.ijstr.org

ISSN 2277-8616

The Effect Of Deposition Time On The Microstructure And Resistivity Of Cu/Ni Thin Film Prepared By Magnetized Electroplating

[Full Text]



Muthi’ah Lutfia Khansa, Moh. Toifur, Guntur Maruto, Yudhiakto Pramudya, Azmi Khusnani



Cu/Ni thin film, electroplating, deposition time, sheet resistivity, microstructure.



Thin films of Cu/Ni have been synthesized by the electroplating method assisted by a magnetic field on the variation of deposition time. The purpose of this paper was to investigate the dependence of sheets resistivity on microstructure obtained through XRD and SEM-EDX tests. Cu plates are used as cathodes and Ni plates as anodes. The electroplating process is carried out at DC voltage of 1.5 volt, 200 gauss magnetic field, 60° C solution temperature, and 4 cm electrode distance. Electrolyte solutions are made from a mixture of H3BO3 (30 g), NiCl2 (195 g), NiSO4 (45 g), and H2O (750 ml). Deposition times varied from 5 s45 s with intervals of 10 s. Based on the results of the microstructure test using XRD, all samples have a crystalline structure with intensity, d-spacing and grain size that varies with the time of deposition. From the EDS analysis, it is known that Ni deposit levels increase with increasing deposition time. The sheet resistivity range from (4.87 ± 0.02)10-3 Ω/sq to (1.38 ± 0.06) 10-3 Ω/sq.



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